Conference Papers

1990 - 1999

1999 1998 1996
1995 1994 1993
1992 1990
  • C93. C.V. Thompson and B.D. Knowlton, Electromigration, Microstructure and IC Interconnect Reliability, Proceedings of the MicroMaterials Conference, p. 97 (1997).
  • C92. M.J. Kobrinsky, E.R. Deutsch, and S.D. Senturia, Influence of Support Compliance and Residual Stress on the Shape of Doubly-Supported Surface-Micromachined Beams, presented at the International Mechanical Engineering Congress, Nashville, 1999.
  • C91. M.J. Kobrinsky and C.V. Thompson, Activation Volume for Inelastic Deformation in Polycrystalline Ag Thin Films, MRS Symposium Proceedings, 594 (1999).
  • C90. Y-.C. Joo, S.P. Baker, E. Arzt, C.V. Thompson, Model Studies of Electromigration Using Indented Single-Crystal Aluminum Lines, 5th International Workshop, Stuttgart, Germany, AIP Conference Proceedings, 491, 100 (1999).
  • C89. C. V. Thompson, V.Andleigh, and S.P. Hau-Riege, Modeling and Experimental Characterization of Electromigration in Interconnect Trees, 5th International Workshop, Stuttgart, Germany, AIP Conference Proceedings, 491, 62 (1999).
  • C88. H.J. Frost and C.V. Thompson, Thin Film Microstructures Produced by Nucleation and Growth-to-Impingement, David A. Smith Symposium Boundaries and Interfaces in Materials, Fall TMS Meeting, Indianapolis, IN (1997).
  • C87. D. Weiss, P. Mullner, C.V. Thompson, and E. Arzt, Grain Growth in Dispersion Hardened Copper Films, Proceedings of the 3rd Int'l. Conf. on Grain Growth, Pittsburgh, PA June 1998.
  • C86. S.P. Riege, C.V. Thompson and H.J. Frost, The effect of Particle-Pinning on Grain Size Distributions in 2D simulations of Grain Growth, Proceedings of the 3rd Int'l. Conf. on Grain Growth, Pittsburgh, PA, June 1998.
  • C85. W. Fayad, V.Andleigh, C. V. Thompson, and H.J. Frost, Grain Structure Statistics in As-Patterned and Annealed Interconnects, MRS Symposium Proceedings, 516, 159 (1998).
  • C84. V.T. Srikar and C.V. Thompson, Modeling Of Grain Structure Evolution And Its Impact On The Reliability Of Al(Cu) Thin Film Interconnects, MRS Symposium Proceedings, 516, 71 (1998).
  • C83. S.P. Riege, V. Andleigh, C.V. Thompson, and H.J. Frost, Modeling Of Grain Structure Evolution And Its Impact On The Reliability Of Al(Cu) Thin Film Interconnects, MRS Symposium Proceedings, 490, 219 (1998).
  • C82. K. Tatah, A. Fukumoto, and C.V. Thompson, Laser Ablation Forward Deposition of Metal Ines for Electrical Interconnect Repair, 1995 IEEE/CPMT Intl. Electronics Manufacturing Technology Symposium Proceedings, 176 (1995).
  • C81. C.V. Thompson and B.D. Knowlton, Designing Circuits and Processes to Optimize Performance and Reliabilty: Metallurgy Meets TCAD, Microelectronics and Reliability, 36, 1683 (1996).
  • C80. S.C. Seel, R. Carel, and C.V. Thompson, Texture Maps for Orientation Evolution During Grain Growth in Thin Film, MRS Symposium Proceedings, 403, 63 (1996).
  • C79. C.V. Thompson, Y.-C. Joo, and B.D. Knowlton, Modeling of the Structure and Reliability of Near-Bamboo Interconnects, MRS Symposium Proceedings, 391, 163 (1995).
  • C78. J.J. Clement, J.R. Lloyd, and C.V. Thompson, Failure in Tungsten-Filled VIA Structures, MRS Symposium Proceedings, 391, 423 (1995
  • C77. B.D. Knowlton, J.J Clement, R.I. Frank, and C.V. Thompson, Coupled Stress Evolution in Polygranular Clusters and Bamboo Segments in Near-Bamboo Interconnects, MRS Symposium Proceedings, 391, 189 (1995).
  • C76. B.D. Knowlton, R.I. Frank, and C.V. Thompson, The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects, MRS Symposium Proceedings, 391, 361 (1995).
  • C75. C.V. Thompson and R. Carel, Grain Growth and Texture Evolution in Thin Films, Materials Science Forums (Proceedings of the 2nd International Conference on Grain Growth, Kitakyushu, Japan), 204-206, 83 (1996).
  • C74. H. Inglefield, G. Bochi, and C.V. Thompson, Study of Misfit Strain Relief Beyond the Critical Thickness Using Substrate Bending and In
    -Situ Characterization of the Magneto-Optic Kerr Effect, MRS Symposium Proceedings, 356, 265 (1995).
  • C73. Y. Hayashi, H.J. Frost, and C.V. Thompson, Grain Growth Modeling of Aluminum Thin-Films with Variations in Grain Boundary Energy, Proceedings of the 46th Symposium on Semiconductors and Integrated Circuits Technology, The Electrochemical Society of Japan, Electronic Materials Committee, Tokyo, Japan, June 2-3, 1994
  • C72. J.A. Floro and C.V. Thompson, Mean Field Analysis of Abnormal Grain Growth Driven by Interface-Energy Isotropy, MRS Symposium Proceedings 343, 65, (1994).
  • C71. H.J. Frost, Y. Hayashi, C.V. Thompson, and D.T. Walton, The Effect of Solute Drag on Grain Growth in Thin Films, MRS Symposium Proceedings, 317, 431 (1994)
  • C70. H.J. Frost, Y. Hayashi, C.V. Thompson, and D.T. Walton, Grain Growth in Thin Films with Variable Grain Boundary Energy, MRS Symposium Proceedings, 317, 485 (1994).
  • C69. J.A. Floro, R. Carel, and C.V. Thompson, Energy Miminization During Epitaxial Grain Growth: Strain vs. Interfacial Energy, MRS Symposium Proceedings, 317, 419 (1994).
  • C68. Y.-C. Joo and C.V. Thompson, Electromigration Lifetimes of Single Crystal Aluminum Lines with Different Crystallographic Orientations, MRS Symposium Proceedings, 338, 319 (1994).
  • C67. R. Carel, C.V. Thompson, and H.J. Frost, Computer Simulation of Strain Energy and Surface and Interface-Energy on Grain Growth in Thin Films, MRS Symposium Proceedings, 343, 49 (1994).
  • C66. C.V. Thompson, Grain Growth in Polycrystalline Thin Films, MRS Symposium Proceedings, 343, 3 (1994).
  • C65. H.J. Frost, Y. Hayashi, C.V. Thompson and D.T. Walton, The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Films Strips, MRS Symposium Proceedings, Spring (1994).
  • C64. C.V. Thompson, New Process Control and Reliability Assessment Challanges Imposed by Submicron Interconnect Technology, Proceedings of the 1993 SEMICON/Korea Technological Symposium (1993).
  • C63. C.V. Thompson, Reliability Issues for Submicron Interconnects and Vias, Proceedings of the Symposium on the Degradation of Electronic Devices Due to Device Operation as Well as Crystalline and Process-Induced Defects, The Electrochemical Society, 94-1, 176 (1994).
  • C62. H.J. Frost and C.V. Thompson, Modeling of Microstructures and Their Effect on Internconnect Reliability, Second International Workshop on Stress Induced Phenomena in Metallization, Austin, TX, March 1993.
  • C61. G. Bochi, C.A. Ballentine, H.E. Inglefield, S.S. Bogomolov, C.V. Thompson, and R.C. O'Handley, Magnetic Anistrophy in Epitaxial Ni/Cu(100) Thin Films, MRS Symposium Proceedings, 313, 309 (1993).
  • C60. H.E. Inglefield, C.A. Ballentine, G. Bochi, S.S. Bogomolov, R.C. O'Handley, and C.V. Thompson, Use of Magno-Optic Kerr Effect Measurements to Study Strain and Misfit Accomodation in Thin Films of Ni/Cu(100), MRS Symposium Proceedings, 308, 765 (1993).
  • C59. C.V. Thompson, The Effect of Thermal History on Interconnect Reliability, MRS Symposium Proceedings, 309, 383 (1993).
  • C58. Y-.C. Joo and C.V. Thompson, Evolution of Electromigration-Induced Aluminum Lines with Different Crysallographic Orientations, MRS Symposium Proceedings, 309, 351 (1993).
  • C57. C.V. Thompson, The Origins of Epitaxial Orientations in Thin Films, MRS Symposium Proceedings, 280, 307 (1993).
  • C56. H.J. Frost, C.V. Thompson, and D.T. Walton, Simultation of Grain Growth in Thin Films, The Minerals, Metals & materials Society, Modeling of Coarsening and Grain Growth, 271 (1993).
  • C55. C.V. Thompson, J.A. Floro, and R. Carel, Modeling of Grain Growth in Thin Films, The Metallurgical Society, Modeling Journal of Coarsening and Grain Growth (1993).
  • C54. H. Miura, E. Ma, and C.V. Thompson, Initial Evolution of Cobalt Silicides in the Cobalt/Amorphous-Silicon Thin Films System, MRS Symposium Proceedings, 230, 139 (1992).
  • C53. H.P. Longworth and C.V. Thompson, Electromigration in Bicrystal AL Lines, MRS Symposium Proceedings, 265, 95 (1992).
  • C52. H. Kahn, C.V. Thompson, and S.S. Cooperman, Reliability of Interconnects Exhibiting Bimodal Electromigration-Induced Failure Distributions, MRS Symposium Proceedings, 265, 65 (1992).
  • C51. E. Ma, L.A. Clevenger, C.V. Thompson, and K.N. Tu, Kinetic and Thermodynamic Aspects of Phase Evolution in Ti/a-Si Multilayer Films, MRS Symposium Proceedings, 187, 83 (1990).
  • C50. H. Kahn and C.V. Thompson, A Statistical Characterization of Electromigration-Induced Open Failures in 2-Level Metal Structures, MRS Symposium Proceedings, 225, 15 (1991).
  • C49. C.V. Thompson, Experimental and Theoretical Aspects of Grain Growth in Thin Films, Materials Science Forums 94-96, 245 (1992).
  • C48. D.T. Walton, H.J. Frost, and C.V. Thompson, Modelling of Grain Growth in Thin Film Strips, Materials Science Forums 94-96, 531 (1992).
  • C47. H.J. Frost, C.V. Thompson, and D.T. Walton, Abnormal Grain Growth in Thin Films Due To Anisotropy of Free-Surface Energies, Materials Science Forum, 94-96, 543 (1992).
  • C46. D.T. Walton, H.J. Frost, and C.V. Thompson, Computer Simulation of Grain growth in Thin-Film Interconnect Lines, MRS Symposium Proceedings, 225, 219 (1991).
  • C45. E. Ma, C.V. Thompson, and L.A. Clevenger, A Calorimetric Study of the Kinetics of Al3Ni Nucleation and growth During Reactions in Al/Ni Thin Films, MRS Symposium Proceedings, 205, 203 (1992).
  • C44. J.S. Im, J.D. Lipman, I.N. Miaoulis, C.K. Chen, and C.V. Thompson, Numerical Modeling of Energy-Beam Induced Localized Melting of Thin Si Films, MRS Symposium Proceedings, 157, 455 (1990).
  • C43. J.A. Floro and C.V. Thompson, Epitaxial Grain Growth and Orientation Metastability in Heteroepitaxial Thin Films, MRS Symposium Proceedings, 187, 273 (1990).
  • C42. C.V. Thompson, L.A. Clevenger, R. DeAvillez, E. Ma, H. Miura, Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/Amorphous-Silicon Multilayer Thin Films, MRS Symposium Proceedings, 187, 61 (1990).