Wednesday, 25 November 2009
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Materials for Micro and Nano Systems

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C. V. Thompson Presentations

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file icon Electromigration in Integrated Circuits: Nano-Scale Processes Affecting the Reliability of Kilometer 02/23/2009
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file icon Bonded Cu Interconnects for Three-Dimensional Circuits 02/23/2009
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file icon The Origin and Control of Residual Stresses in Nanocrystalline Thin Films: The Roles of Stress Relax 02/23/2009
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file icon Texture Development and Abnormal Grain Growth in Thin Films 02/23/2009
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file icon Carbon Nanotube Interconnects? 02/23/2009
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