Processing of bulk, thin film, and nanoscale materials for applications in electronic, magnetic, electromechanical and photonic devices and microsystems. Topics include growth of bulk, thin-film, nanoscale single crystals via vapor and liquid phase processes; formation, patterining and processing of thin films, with an emphasis on relationships among processing, structure, and properties; and processing of systems of nanoscale materials. Examples from materials processing for applications in high-performance integrated electronic circuits, integrated sensors, and data storage systems.

Prereq: 3.205/3.225 or 3.20 and 3.21

(MIT 3.47)

Coverage includes techniques and underlying principles for synthesis and assembly of materials with one or more nanoscale dimensions, in the form of individual molecules, dots, wires, tubes, or sheets. Focuses on materials with applications arising from size-dependent electronic magnetic, photonic, chemical, or mechanical properties. Synthesis via both physical processes (e.g. lithography, physical vapor deposition) and chemical processes (e.g. chemical vapor deposition, growth from liquid and solid solutions) are discussed. Thermodynamically-driven and kenetically-driven self-assembly processes are described as illustrations of fundamental assembly mechanisms. The formation of hierarchical ordered structures by templated self assembly are also discussed. Lectures complemented by case studies given by the instructors and by outside speakers.storage systems.

Prereq: 3.20 and 3.21, or 3.205 and 3.44

(MIT 3.48J)

Unified treatment of key principles in materials and processing for design and manufacture of microelectromechanical systems (MEMS). Emphasis on materials and processes commonly used for fabrication for MEMS and non micro electronic systems. Discussion of the processing and properties of both thin and thick polycrystalline and amorphous films, wafer and thin film bonding, bulk micromachining techniques, and the relationships between processing and properties of active materials such as piezoelectrics, ferroelectrics and phase-transition materials. Key material properties and parameters and their relationships with microfabrication processes and applications are discussed, including eleastic and inelastic deformation, fracture, residual stress, fatigue, creep, adhesion, stiction, and coupled-field constitutive behavior. Materials and process selection and case studies of applications provide a unifying theme.

Prereq: 6.152J/3.155J; permission of instructor