Materials for Micro and Nano Systems - 2008

Journal Publications

2008 - Present

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J166. W.K. Choi, T.H. Liew, H.G. Chew, F. Zheng, C.V.Thompson, Y. Wang, M.H. Hong, X.D. Wang, L. Li and J. Yun,, "A combined Top-down and Bottom-up approach for Precise Placement of Metal Nanoparticles on Silicon, "Small 4, 330 (2008)

J167. J. Oh and C.V. Thompson, "Selective Barrier Perforation in Porous Alumina Andoized on Substrates," Advanced Materials 20, 1368 (2008).

J168. F.L. Wei, C.S. Hau-Riege, A.P. Marathe, and C.V. Thompson, "Effects of active atomic sinks and reservoirs on the reliability of Cu/low-k interconnects," J. Appl. Phys. 103, 084513 (2008).

J169. F.L. Wei, Chee Lip GAn, Tam Lyn Tan, C.S. HaupRiege, A.P. Marathe, F.L. Vlassak and C.V. Thompson, "Electromigration-induced extrusion failures in Cu/low-k Interconnects," J. Appl. Phys. 104, 023529 (2008).

J170. J.A. Kalb, Q.Guo, X. Zhang, Yi Li, C. Sow and C.V. Thompson, "Phase Change Materials in Optically Triggered Microactuators," J. of Microelectromechanical Systems, 17, No. 5, (2008).

J171. Gilbert D. Nessim, A. John Hart, Jin S. Kim, Donatello Acquaviva, Jihun Oh, Caitlin D. Morgan, Matteo Seita, Jeffrey S. Leib, and Carl V. Thompson, Tuning of Vertically-Aligned Carbon Nanotube Diameter and Areal Density through Catalyst Pre-Treatment, Nano Letters 8, 3587 (2008).

J172. W. K. Choi, T. H. Liew, M. K. Dawood, H. I. Smith , C. V. Thompson, and M. H. Hong, Synthesis of silicon nanowires and nanofin arrays using interference lithography and catalytic etching, Nano Letters 8, 3799 (2008).

J173. Yong-Jun Oh, C. A. Ross, Yeon Sik Jung, Yang Wang, Carl V. Thompson, Co nanoparticle arrays made by templated solid-state dewetting, Small, in press.

J174. Qiang Guo, Minghua Li, Yi Li, Luping Shi, Tow Chong Chong, Johannes A. Kalb, and Carl V. Thompson, Crystallization-induced stress in thin phase change films of different thicknesses, Appl. Phys. Lett., 93, 221907 (2008).
J175. Y. Li, Q. Guo, J.A. Kalb, and C.V. Thompson, Matching Glass-Forming Ability with the Density of the Amorphous Phase, Science 322, 1816 (2008).
J176. H. L. Leong, C. L. Gan, R. I. Made, C. V. Thompson, K. L. Pey, and H. Y. Li, Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects, J. Appl. Phys. 105, 033514 (2009).
J177. H. L. Leong, C. L. Gan, C. V. Thompson, K. L. Pey, and H. Y. Li, Electromigration-induced bond improvement for three-dimensional integrated circuits, Appl. Phys. Letts. 94 (2009).
J178. S.-W. Chang, V.P. Chuang, S.T. Boles, C.A. Ross, and C.V. Thompson, Densely-packed arrays of ultrahigh-aspect-ratio silicon nanowire fabricated using block copolymer lithography and metal-assisted etching, Advanced Functional Materials 19, 2495 (2009).
J179. S.T. Boles, C.V. Thompson, and E.A. Fitzgerald, Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si substrates, J. Cryst. Growth 311, 1446 (2009).
J180. Gilbert D. Nessim, Matteo Seita, Kevin P. O’Brien, A. John Hart, Pierre Delcoix, and Carl V. Thompson, Low Temperature Synthesis of Vertically Aligned Carbon Nanotubes with Ohmic Contact to Metallic Substrates Enabled by Thermal Decomposition of the Carbon Feedstock, Nano
Letters, in press.
J181. J. Leib, R. Monig, C.V. Thompson, Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films, Phys. Rev. Letters 102, 25601 (2009).
J182. Osama M. Nayfeh,* Dimitri A. Antoniadis, Steven Boles, Charles Ho, and Carl V. Thompson, Formation of Single Tiers of Bridging Silicon Nanowires for Transistor Applications Using Vapor– Liquid–Solid Growth from Short Silicon-on-Insulator Sidewalls, Small (2009).