Electromigration in Integrated Circuits: Nano-Scale Processes Affecting the Reliability of Kilometers of Wiring |
Carl V. Thompson, Zung-Sung Choi*, and Reiner Mönig*
Dept. of Materials Science and Engineering
Microsystems Technology Laboratory
Massachusetts Institute of Technolog |
Objective:- Overview of IC interconnect technology and electromigration
- In-situ observation of electromigration void dynamics
- Simulations
- Conclusions
*now with Samsung, ** now with Forschungszentrum Karlsruhe |
IC Interconnects-Metallization
| |  Fairchild first IC |
Multiple Layers of Interconnection
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| | (with SiO2 selectively removed) (cross-section with SiO2) | |
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